Browsing Innovation in Manufacturing Systems and Technology (IMST) by Author "Chun, Jung-Hoon"

Now showing items 1-7 of 7

    • Droplet Bouncing Behavior in the Direct Solder Bumping Process 

      Hsiao, Wayne; Chun, Jung-Hoon (2003-01)
      This paper presents the results of an ongoing effort to develop a direct solder bumping process for electronics packaging. The proposed process entails delivering molten droplets onto specific locations on electronic devices ...

    • A Mechanical Model for Erosion in Copper Chemical-Mechanical Polishing 

      Noh, Kyungyoon; Saka, Nannaji; Chun, Jung-Hoon (2003-01)
      The Chemical-mechanical polishing (CMP) process is now widely employed in the ultralarge scale integration chip fabrication. Due to the continuous advances in semiconductor fabrication technology and decreasing sub-micron ...

    • Mechanics,Mechanisms and Modeling of the Chemical Mechanical Polishing Process 

      Noh, Kyungyoon; Lai, Jiun-Yu; Saka, Nannaji; Chun, Jung-Hoon (2002-01)
      The Chemical Mechanical polishing (CMP) process is now widely employed in the Integrated Circuit Fabrication. However, due to the complexity of process parameters on the material removal rate (MRR), mechanism of material ...

    • Modeling Dielectric Erosion in Multi-Step Copper Chemical-Mechanical Polishing 

      Chun, Jung-Hoon; Saka, Nannaji; Noh, Kyungyoon (2004-01)
      A formidable challenge in the present multi-step Cu CMP process, employed in the ultra-large-scale integration (ULSI) technology, is the control of wafer surface non-uniformity, which primarily is due to dielectric erosion ...

    • A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing 

      Noh, Kyungyoon; Saka, Nannaji; Chun, Jung-Hoon (2005-01)
      The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the ...

    • Recent Progress in Droplet-Based Manufacturing Research 

      Kim, H.-Y.; Cherng, J.-P.; Chun, Jung-Hoon (2002-01)
      This article reports the recent progress of re-search made in the Droplet-Based Manufacturing Laboratory at MIT. The study has been focused on obtaining a fundamental understanding of microdroplet deposition and applying ...

    • UV Embossed Plastic Chip for Protein Separation and Identification 

      Guo, Xun; Chan-Park, Mary Bee-Eng; Yoon, Soon Fatt; Chun, Jung-Hoon; Hua, Lin; e.a. (2005-01)
      This report demonstrates a UV-embossed polymeric chip for protein separation and identification by Capillary Isoelectric Focusing (CIEF) and Matrix Assisted Laser Desportion/Ionization Mass Spectrometry (MALDI-MS). The ...