Browsing Innovation in Manufacturing Systems and Technology (IMST) by Author "Boning, Duane S."

Now showing items 1-2 of 2

Characterization and Modeling of Chemical-Mechanical Polishing for Polysilicon Microstructures

Tang, Brian D.; Boning, Duane S. (2004-01)

Long the dominant method of wafer planarization in the integrated circuit (IC) industry, chemical-mechanical polishing is starting to play an important role in microelectromechnical systems (MEMS). We present an experiment ...
A Two-level Prediction Model for Deep Reactive Ion Etch (DRIE)

Taylor, Hayden K.; Sun, Hongwei; Hill, Tyrone F.; Schmidt, Martin A.; Boning, Duane S. (2005-01)

We contribute a quantitative and systematic model to capture etch non-uniformity in deep reactive ion etch of microelectromechanical systems (MEMS) devices. Deep reactive ion etch is commonly used in MEMS fabrication where ...