dc.contributor.author | Fonstad, Clifton G., Jr. | en_US |
dc.contributor.author | Ahadian, Joseph F. | en_US |
dc.contributor.author | Royter, Yakov | en_US |
dc.contributor.author | Patterson, Steven G. | en_US |
dc.contributor.author | Viadyananthan, Praveen T. | en_US |
dc.contributor.author | Postigo, P. Aitor | en_US |
dc.contributor.author | Petrich, Gale S. | en_US |
dc.contributor.author | Kolodziejski, Leslie A. | en_US |
dc.contributor.author | Mikkelson, James M. | en_US |
dc.contributor.author | Goodhue, William D. | en_US |
dc.contributor.author | Braddock, David | en_US |
dc.contributor.author | Mull, Daniel E. | en_US |
dc.contributor.author | Choy, Henry K. | en_US |
dc.contributor.author | Ram, Rajeev J. | en_US |
dc.contributor.author | Hoshino, Isako | en_US |
dc.contributor.author | Prasad, Sheila | en_US |
dc.contributor.author | Wang, Haifeng | en_US |
dc.contributor.author | Hemenway, Roe B., Jr. | en_US |
dc.contributor.author | Deming, Robert | en_US |
dc.contributor.author | Knoedl, Thomas | en_US |
dc.contributor.author | London, Joanna | en_US |
dc.contributor.author | Crankshaw, Donald S. | en_US |
dc.contributor.author | Pan, Janet L. | en_US |
dc.date.accessioned | 2010-07-17T01:38:45Z | |
dc.date.available | 2010-07-17T01:38:45Z | |
dc.date.issued | 1997-01-01 to 1997-12-31 | en_US |
dc.identifier | RLE_PR_140_01_01s_01 | en_US |
dc.identifier.uri | http://hdl.handle.net/1721.1/57412 | |
dc.description | Contains table of contents for Part I, table of contents for Section 1, an introduction, reports on thirteen research projects and a list of publications. | en_US |
dc.description.sponsorship | Defense Advanced Research Projects Agency | en_US |
dc.description.sponsorship | Joint Services Electronics Program Grant DAAH04-95-1-0038 | en_US |
dc.description.sponsorship | MIT Lincoln Laboratory | en_US |
dc.description.sponsorship | National Science Foundation | en_US |
dc.description.sponsorship | U.S. Navy - Office of Naval Research | en_US |
dc.description.sponsorship | Defense Advanced Research Projects Agency/National Center for Integrated Photonics Technology | en_US |
dc.description.sponsorship | MIT Lincoln Laboratory | en_US |
dc.description.sponsorship | National Center for Integrated Photonics Technology | en_US |
dc.description.sponsorship | University of Ulm, Ulm, Germany | en_US |
dc.description.sponsorship | General Motors Corporation Fellowship | en_US |
dc.description.sponsorship | Lockheed-Martin Corporation | en_US |
dc.language.iso | en | en_US |
dc.publisher | Research Laboratory of Electronics (RLE) at the Massachusetts Institute of Technology (MIT) | en_US |
dc.relation.ispartof | Massachusetts Institute of Technology, Research Laboratory of Electronics, Progress Report, January 1 - December 31, 1997 | en_US |
dc.relation.ispartof | Solid State Physics, Electronics and Optics | en_US |
dc.relation.ispartof | Materials and Fabrication | en_US |
dc.relation.ispartof | Compound Semiconductor Materials and Devices | en_US |
dc.relation.ispartofseries | Massachusetts Institute of Technology. Research Laboratory of Electronics. Progress Report, no. 140 | en_US |
dc.rights | Copyright (c) 2008 by the Massachusetts Institute of Technology. All rights reserved. | en_US |
dc.subject.other | Compound Semiconductor Materials | en_US |
dc.subject.other | Compound Semiconductor Devices | en_US |
dc.subject.other | Epitaxy-on-Electronics Integration Technology | en_US |
dc.subject.other | InGaAsP/GaAs Light Emitting Diodes Monolithically Integrated on GaAs VLSI Electronics | en_US |
dc.subject.other | The OPTOCHIP Project | en_US |
dc.subject.other | Low-Temperature Growth of Aluminum-Free InGaP/GaAs/InGaAs LED | en_US |
dc.subject.other | Laser Diode Heterostructures by Solid Source MBE using a GaP Cell | en_US |
dc.subject.other | Dry-Etch Technololgy for Aluminum-free InGaP/GaAs/InGaAs Laser Diode Facets | en_US |
dc.subject.other | Dry-Etch Technololgy for Aluminum-free InGaP/GaAs/InGaAs Laser Diode Deflectors | en_US |
dc.subject.other | Monolithic Integration of Vertical-Cavity Surface-Emitting Laser Diodes on GaAs VLSI Electronics | en_US |
dc.subject.other | Hyperthermal Molecular Beam Dry Etching of III-V Compound Semiconductors | en_US |
dc.subject.other | Microwave Characterization of Optoelectronic Devices | en_US |
dc.subject.other | Monolithic Integration of 1550 nm Photodetectors on GaAs Transimpedance Amplifier Chips | en_US |
dc.subject.other | Design of VCSEL-Based Resonant Cavity Enhanced Photodetectors | en_US |
dc.subject.other | Analysis of VCSEL-Based Resonant Cavity Enhanced Photodetectors | en_US |
dc.subject.other | Si-on-GaAs | en_US |
dc.subject.other | Monolithic Heterogeneous Integration of Si CMOS with GaAs Optoelectronic Devices using EoE Techniques | en_US |
dc.subject.other | Monolithic Heterogeneous Integration of Si CMOS with GaAs Optoelectronic Devices using SOI Techniques | en_US |
dc.subject.other | Monolithic Heterogeneous Integration of Si CMOS with GaAs Optoelectronic Devices using MEMS Techniques | en_US |
dc.subject.other | Aligned, Selective-Area Wafer-Scale Bonding of Optoelectronic Devices on GaAs Integrated Circuits | en_US |
dc.subject.other | Normal-Incidence Quantum Well Intersubband Photodetectors (QWIPs) for Monolithic Integration | en_US |
dc.title | Compound Semiconductor Materials and Devices | en_US |
dc.type | Technical Report | en_US |