Browsing Advanced Materials for Micro- and Nano-Systems (AMMNS) by Subject "ball bond"

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Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation

Shah, M.; Zeng, K.; Tay, A.A.O.; Suresh, Subra (2002-01)

With increasing miniaturization in microelectronics the wirebonds used in IC packages are witnessing a thrust towards fine pitch wirebonding. To have a precise control over loop height of the wirebond for fine pitch ...