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dc.contributor.authorFitzgerald, Eugene A.
dc.contributor.authorLee, Minjoo L.
dc.contributor.authorLeitz, Christopher W.
dc.contributor.authorAntoniadis, Dimitri A.
dc.date.accessioned2003-11-24T21:01:53Z
dc.date.available2003-11-24T21:01:53Z
dc.date.issued2003-01
dc.identifier.urihttp://hdl.handle.net/1721.1/3726
dc.description.abstractBiaxial tensile strained Si grown on SiGe virtual substrates will be incorporated into future generations of CMOS technology due to the lack of performance increase with scaling. Compressively strained Ge-rich alloys with high hole mobilities can also be grown on relaxed SiGe. We review progress in strained Si and dual channel heterostructures, and also introduce high hole mobility digital alloy heterostructures. By optimizing growth conditions and understanding the physics of hole and electron transport in these devices, we have fabricated nearly symmetric mobility p- and n-MOSFETs on a common Si₀.₅Ge₀.₅ virtual substrate.en
dc.description.sponsorshipSingapore-MIT Alliance (SMA)en
dc.format.extent460990 bytes
dc.format.mimetypeapplication/pdf
dc.language.isoen_US
dc.relation.ispartofseriesAdvanced Materials for Micro- and Nano-Systems (AMMNS);
dc.subjectSiGeen
dc.subjectstrained siliconen
dc.subjectgermaniumen
dc.subjectMOSFETsen
dc.subjecthole mobilityen
dc.titleMOSFET Channel Engineering using Strained Si, SiGe, and Ge Channelsen
dc.typeArticleen


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