Browsing Molecular Engineering of Biological and Chemical Systems (MEBCS) by Author "Chun, Jung-Hoon"

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    • A Multi-scale Model for Copper Dishing in Chemical-Mechanical Polishing 

      Noh, Kyungyoon; Saka, Nannaji; Chun, Jung-Hoon (2005-01)
      The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the ...